PAI SP604 (SnAg0.1Cu0.5+Ni+Ge) Solder Bar
PAI SP-604 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SP-604 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.